| MOQ: | 1pcs |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchi a vuoto+cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/t |
| Capacità di approvvigionamento: | 5000pcs al mese |
This 2-layer rigid PCB caters to versatile RF and microwave applications, utilizing TLX-0—a PTFE fiberglass composite—to offer stable electrical performance and outstanding resilience in harsh environments (e.g., vibration, extreme temperatures, radiation). Every construction detail, from material selection to hole treatment, is optimized for low-layer-count microwave designs, ensuring reliability across use cases like radar systems and mobile communications. Key specifications are as follows:
1. PCB Specifications
| Parameter | Details |
| Base Material | TLX-0 |
| Layer Count | 2-layer (rigid structure) |
| Board Dimensions | 175mm x 90mm per piece (10PCS total), with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Hole Treatment | Holes plugged by green solder mask ink |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for both outer layers |
| Surface Finish | Immersion Gold |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
2. PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Core Layer | TLX-0 | 0.508mm (20mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
3. Quality & Global Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Globally accessible
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4. Rogers TLX-0 Material Introduction
TLX-0 is a flagship material in the TLX series—PTFE fiberglass composites engineered as "workhorses" for the RF/microwave substrate world. Its core strength lies in versatility and environmental resilience.
TLX-0 stands out for its tight dielectric constant (Dk) control: 2.45 ± 0.04, making it ideal for low-layer-count microwave designs where signal predictability is critical. Its PTFE fiberglass composition balances mechanical reinforcement (via fiberglass) with the low-loss electrical properties of PTFE, eliminating the need for complex multi-layer structures in many RF applications.
5. TLX-0 Key Features
The material’s features are tailored to address RF/microwave challenges—from signal stability to environmental durability:
| Feature | Specification |
| Dielectric Constant (Dk) | 2.45 ± 0.04 at 10GHz |
| Dissipation Factor (DF) | 0.0021 at 10GHz |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 21 ppm/°C; Y-axis: 23 ppm/°C; Z-axis: 215 ppm/°C |
| Peel Strength | 12 lbs/in (ensures strong copper-to-substrate bonding) |
| Flammability Rating | UL 94 V0 |
6. Material Benefits
TLX-0’s properties translate to tangible advantages for the PCB, solving key pain points in RF/microwave design and harsh-environment operation:
-Exceptional Signal Quality: Low DF (0.0021 at 10GHz) and tightly controlled Dk (2.45 ± 0.04) minimize signal loss and ensure predictable impedance—critical for couplers, splitters, and amplifiers.
-Superior Passive Intermodulation (PIM) Performance: Measures lower than -160 dBc, eliminating signal distortion in high-power RF systems (e.g., radar, mobile base stations).
-Environmental Resilience: Fiberglass reinforcement resists creep (vibration stability), low moisture absorption (0.02%) prevents performance degradation in humid/marine settings, and radiation resistance suits space applications (per NASA’s low-outgassing standards).
-Mechanical Durability: High peel strength (12 lbs/in) ensures long-term copper bonding, even under thermal cycling or physical stress.
-Safety & Compliance: UL 94 V0 flammability rating meets global safety standards for electronic equipment in enclosed or high-risk environments.
7. Typical Applications
Leveraging its versatility, environmental resilience, and stable RF performance, this PCB is ideally suited for:
-RF/Microwave Components: Couplers, splitters, combiners, amplifiers, antennas, and passive components.
-Radar Systems: Ground-based, airborne, or marine radar (resists vibration and temperature extremes).
-Mobile Communications: Infrastructure for 4G/5G networks (low signal loss and PIM performance).
-Test & Measurement: Microwave test equipment (requires precise signal integrity).
-Specialized Environments: Space applications (radiation resistance, low outgassing), warship antennas (saltwater resilience), and engine-module electronics (high-temperature tolerance).
-Transmission Devices: Microwave transmission equipment for long-range data/signal transfer.
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| MOQ: | 1pcs |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchi a vuoto+cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/t |
| Capacità di approvvigionamento: | 5000pcs al mese |
This 2-layer rigid PCB caters to versatile RF and microwave applications, utilizing TLX-0—a PTFE fiberglass composite—to offer stable electrical performance and outstanding resilience in harsh environments (e.g., vibration, extreme temperatures, radiation). Every construction detail, from material selection to hole treatment, is optimized for low-layer-count microwave designs, ensuring reliability across use cases like radar systems and mobile communications. Key specifications are as follows:
1. PCB Specifications
| Parameter | Details |
| Base Material | TLX-0 |
| Layer Count | 2-layer (rigid structure) |
| Board Dimensions | 175mm x 90mm per piece (10PCS total), with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Hole Treatment | Holes plugged by green solder mask ink |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for both outer layers |
| Surface Finish | Immersion Gold |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
2. PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Core Layer | TLX-0 | 0.508mm (20mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
3. Quality & Global Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Globally accessible
![]()
4. Rogers TLX-0 Material Introduction
TLX-0 is a flagship material in the TLX series—PTFE fiberglass composites engineered as "workhorses" for the RF/microwave substrate world. Its core strength lies in versatility and environmental resilience.
TLX-0 stands out for its tight dielectric constant (Dk) control: 2.45 ± 0.04, making it ideal for low-layer-count microwave designs where signal predictability is critical. Its PTFE fiberglass composition balances mechanical reinforcement (via fiberglass) with the low-loss electrical properties of PTFE, eliminating the need for complex multi-layer structures in many RF applications.
5. TLX-0 Key Features
The material’s features are tailored to address RF/microwave challenges—from signal stability to environmental durability:
| Feature | Specification |
| Dielectric Constant (Dk) | 2.45 ± 0.04 at 10GHz |
| Dissipation Factor (DF) | 0.0021 at 10GHz |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 21 ppm/°C; Y-axis: 23 ppm/°C; Z-axis: 215 ppm/°C |
| Peel Strength | 12 lbs/in (ensures strong copper-to-substrate bonding) |
| Flammability Rating | UL 94 V0 |
6. Material Benefits
TLX-0’s properties translate to tangible advantages for the PCB, solving key pain points in RF/microwave design and harsh-environment operation:
-Exceptional Signal Quality: Low DF (0.0021 at 10GHz) and tightly controlled Dk (2.45 ± 0.04) minimize signal loss and ensure predictable impedance—critical for couplers, splitters, and amplifiers.
-Superior Passive Intermodulation (PIM) Performance: Measures lower than -160 dBc, eliminating signal distortion in high-power RF systems (e.g., radar, mobile base stations).
-Environmental Resilience: Fiberglass reinforcement resists creep (vibration stability), low moisture absorption (0.02%) prevents performance degradation in humid/marine settings, and radiation resistance suits space applications (per NASA’s low-outgassing standards).
-Mechanical Durability: High peel strength (12 lbs/in) ensures long-term copper bonding, even under thermal cycling or physical stress.
-Safety & Compliance: UL 94 V0 flammability rating meets global safety standards for electronic equipment in enclosed or high-risk environments.
7. Typical Applications
Leveraging its versatility, environmental resilience, and stable RF performance, this PCB is ideally suited for:
-RF/Microwave Components: Couplers, splitters, combiners, amplifiers, antennas, and passive components.
-Radar Systems: Ground-based, airborne, or marine radar (resists vibration and temperature extremes).
-Mobile Communications: Infrastructure for 4G/5G networks (low signal loss and PIM performance).
-Test & Measurement: Microwave test equipment (requires precise signal integrity).
-Specialized Environments: Space applications (radiation resistance, low outgassing), warship antennas (saltwater resilience), and engine-module electronics (high-temperature tolerance).
-Transmission Devices: Microwave transmission equipment for long-range data/signal transfer.
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