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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchi a vuoto+cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000pcs al mese

Dettagli Informazioni

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Materiale di base:

F4BTMS450

Conta dei strati:

4 strati

Spessore del PCB:

1,4 mm

Dimensioni del circuito stampato:

20 mm x 20 mm per unità (tolleranza: ±0,15 mm)

Silkscreen:

Maschera di saldatura:

Peso di rame:

1 oncia (1,4 mil/35μm)

Finitura superficiale:

oro di immersione

Evidenziare:

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Descrizione del prodotto

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Tag:

prodotti

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchi a vuoto+cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000pcs al mese

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Cina

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Materiale di base:

F4BTMS450

Conta dei strati:

4 strati

Spessore del PCB:

1,4 mm

Dimensioni del circuito stampato:

20 mm x 20 mm per unità (tolleranza: ±0,15 mm)

Silkscreen:

Maschera di saldatura:

Peso di rame:

1 oncia (1,4 mil/35μm)

Finitura superficiale:

oro di immersione

Quantità di ordine minimo:

1 pz

Prezzo:

USD9.99-99.99

Imballaggi particolari:

Sacchi a vuoto+cartoni

Tempi di consegna:

8-9 giorni lavorativi

Termini di pagamento:

T/T

Capacità di alimentazione:

5000pcs al mese

Evidenziare

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Descrizione del prodotto

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Tag:

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,