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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchi a vuoto+cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000pcs al mese

Dettagli Informazioni

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Materiale di base:

Rogers TMM4

Conta dei strati:

2 strati

Spessore del PCB:

1,6 mm

Dimensioni del circuito stampato:

47 mm x 118 mm (1 pezzo)±0,15 mm

Silkscreen:

Bianco

Maschera di saldatura:

Verde

Peso di rame:

1 oncia (equivalente a 1,4 mil/35 μm per strato)

Finitura superficiale:

Placcatura in argento e oro (oro su argento)

Evidenziare:

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

Descrizione del prodotto

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

This high-performance 2-layer PCB is built with Rogers TMM4--a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.

PCB Specification

Parameter	Details
Base Material	Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count	2-layer rigid PCB
Board Dimensions	47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.35mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	1.6mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Silver and Gold Plating (Gold over Silver) - ensures corrosion resistance, reliable soldering, and long-term contact performance
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers TMM4	1.524 mm (60 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers TMM4

Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials--offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4's thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.

Key Material Features

Specification	Value
Material Type	Ceramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk)	4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz	0.0020
Thermal Coefficient of Dk (TCDk)	15 ppm/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA)	425 °C
Thermal Conductivity	0.7 W/mK
Moisture Absorption	0.07% - 0.18%
Available Thickness Range	0.0015 - 0.500 inches (±0.0015 inches)
CTE Compatibility	Matched to copper

Core Benefits

Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation--critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.

Typical Applications

This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers

Tag:

prodotti

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchi a vuoto+cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000pcs al mese

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Cina

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Materiale di base:

Rogers TMM4

Conta dei strati:

2 strati

Spessore del PCB:

1,6 mm

Dimensioni del circuito stampato:

47 mm x 118 mm (1 pezzo)±0,15 mm

Silkscreen:

Bianco

Maschera di saldatura:

Verde

Peso di rame:

1 oncia (equivalente a 1,4 mil/35 μm per strato)

Finitura superficiale:

Placcatura in argento e oro (oro su argento)

Quantità di ordine minimo:

1 pz

Prezzo:

USD9.99-99.99

Imballaggi particolari:

Sacchi a vuoto+cartoni

Tempi di consegna:

8-9 giorni lavorativi

Termini di pagamento:

T/T

Capacità di alimentazione:

5000pcs al mese

Evidenziare

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

Descrizione del prodotto

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

PCB Specification

Parameter	Details
Base Material	Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count	2-layer rigid PCB
Board Dimensions	47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.35mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	1.6mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Silver and Gold Plating (Gold over Silver) - ensures corrosion resistance, reliable soldering, and long-term contact performance
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers TMM4	1.524 mm (60 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers TMM4

Key Material Features

Specification	Value
Material Type	Ceramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk)	4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz	0.0020
Thermal Coefficient of Dk (TCDk)	15 ppm/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA)	425 °C
Thermal Conductivity	0.7 W/mK
Moisture Absorption	0.07% - 0.18%
Available Thickness Range	0.0015 - 0.500 inches (±0.0015 inches)
CTE Compatibility	Matched to copper

Core Benefits

Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation--critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.

Typical Applications

This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers

Tag:

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

1oz RF PCB Board,

1.6mm RF PCB Board,

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

1oz RF PCB Board,

1.6mm RF PCB Board,