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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nome

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Dettagli Informazioni
Descrizione del prodotto
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO4003C a basso profilo (LoPro)
Conta dei strati:
2 strati
Spessore del PCB:
0,65 mm
Dimensioni del circuito stampato:
64 mm x 68,4 mm per pezzo (1 pezzo)
Silkscreen:
Bianco
Maschera di saldatura:
Verde
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
Sottoplaccatura argento + Placcatura oro
Evidenziare:

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descrizione del prodotto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Tag: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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prodotti
Dettagli dei prodotti
prodotti

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nome
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Informazioni dettagliate
Descrizione del prodotto
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO4003C a basso profilo (LoPro)
Conta dei strati:
2 strati
Spessore del PCB:
0,65 mm
Dimensioni del circuito stampato:
64 mm x 68,4 mm per pezzo (1 pezzo)
Silkscreen:
Bianco
Maschera di saldatura:
Verde
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
Sottoplaccatura argento + Placcatura oro
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchi a vuoto+cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000pcs al mese
Evidenziare

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descrizione del prodotto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Tag: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, Cina 518103
Tel: 86-755-27374946
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