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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

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Laminati rivestiti di rame

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RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchetti sottovuoto+Cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000 pezzi al mese

Dettagli Informazioni

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Numero di parte:

Duroide RT 6202

Spessore laminato:

0,005" (0,127 mm) +/- 0,0005" 0,020" (0,508 mm) +/- 0,0010" 0,030" (0,762 m

Dimensioni del laminato:

12"X 18"(305mm X 457mm) 24"X 18"(610mm X 457mm)

Peso del rame:

Foglio di rame elettrodepositato ½ oncia. (18 µm) HH/HH 1 oncia. (35 µm) Foglio di rame arrotolato H

Evidenziare:

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Descrizione del prodotto

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Ensures excellent high-frequency performance
Tight εr and Thickness Control: Provides consistent electrical characteristics
Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
Very Low Etch Shrinkage: Improves precision in circuit fabrication

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

Property Dielectric Constant ε r	Typical Value 2.94 ± 0.04 [3]	Direction Z	Units -	Conditions 10GHz/23°C	Test Method IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ	0.0015	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+5	Z	ppm/°C	10 GHz -50 to +150°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	106	Z	Mohm cm	A	ASTM D257
Surface Resistivity	109	Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)	X, Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	30 (4.3)	X, Y	MPs (kpsi)
Ultimate Strain	4.9	X, Y	%
Compressive Modulus	1035 (150)	Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.04	-	%	D23/24 D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Thermal Conductivity	0.68	-	W/m/K	80°C	ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C)	15 15 30	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Dimensional Stability	0.07	X, Y	mm/m (mil/inch)	after etch +E/150	IPC-TM-650, 2.4.3.9
Td	500		°CTGA		ASTM D3850
Density	2.1		gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)	-	J/g/K (BTU/lb/°F)	-	Calculated
Copper Peel	9.1 (1.6)		lbs/in (N/mm)		IPC-TM-650 2.4.8
Flammability	V-O				UL 94
Lead-Free Process Com- patible	YES

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

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Laminati rivestiti di rame

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1 pz
prezzo:	USD9.99-99.99
Imballaggio standard:	Sacchetti sottovuoto+Cartoni
Periodo di consegna:	8-9 giorni lavorativi
Metodo di pagamento:	T/T
Capacità di approvvigionamento:	5000 pezzi al mese

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine

Cina

Marca

Bicheng

Certificazione

UL, ISO9001, IATF16949

Numero di modello

BIC-332.V1.0

Numero di parte:

Duroide RT 6202

Spessore laminato:

0,005" (0,127 mm) +/- 0,0005" 0,020" (0,508 mm) +/- 0,0010" 0,030" (0,762 m

Dimensioni del laminato:

12"X 18"(305mm X 457mm) 24"X 18"(610mm X 457mm)

Peso del rame:

Foglio di rame elettrodepositato ½ oncia. (18 µm) HH/HH 1 oncia. (35 µm) Foglio di rame arrotolato H

Quantità di ordine minimo:

1 pz

Prezzo:

USD9.99-99.99

Imballaggi particolari:

Sacchetti sottovuoto+Cartoni

Tempi di consegna:

8-9 giorni lavorativi

Termini di pagamento:

T/T

Capacità di alimentazione:

5000 pezzi al mese

Evidenziare

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Descrizione del prodotto

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Ensures excellent high-frequency performance
Tight εr and Thickness Control: Provides consistent electrical characteristics
Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
Very Low Etch Shrinkage: Improves precision in circuit fabrication

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

Property Dielectric Constant ε r	Typical Value 2.94 ± 0.04 [3]	Direction Z	Units -	Conditions 10GHz/23°C	Test Method IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ	0.0015	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+5	Z	ppm/°C	10 GHz -50 to +150°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	106	Z	Mohm cm	A	ASTM D257
Surface Resistivity	109	Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)	X, Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	30 (4.3)	X, Y	MPs (kpsi)
Ultimate Strain	4.9	X, Y	%
Compressive Modulus	1035 (150)	Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.04	-	%	D23/24 D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Thermal Conductivity	0.68	-	W/m/K	80°C	ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C)	15 15 30	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Dimensional Stability	0.07	X, Y	mm/m (mil/inch)	after etch +E/150	IPC-TM-650, 2.4.3.9
Td	500		°CTGA		ASTM D3850
Density	2.1		gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)	-	J/g/K (BTU/lb/°F)	-	Calculated
Copper Peel	9.1 (1.6)		lbs/in (N/mm)		IPC-TM-650 2.4.8
Flammability	V-O				UL 94
Lead-Free Process Com- patible	YES

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

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