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F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Numero di parte:
F4BME265
Spessore laminato:
0,1 - 12 mm
Dimensioni del laminato:
460X610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840m
Peso del rame:
0,5 once (0,018 mm); 1 oncia (0,035 mm);
Evidenziare:

F4BME265 high frequency copper laminate

,

copper clad sheet substrate

,

high frequency laminates with warranty

Descrizione del prodotto

The F4BME265 is a high-frequency laminate manufactured through a precisely controlled process using woven glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film. Offering enhanced electrical performance compared to standard F4B materials, it features a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, making it a reliable alternative to equivalent foreign products.

 

The F4BM and F4BME series share an identical dielectric core but are differentiated by their copper foil type:

 

F4BM is paired with ED (electrodeposited) copper foil, designed for applications where Passive Intermodulation (PIM) is not a critical factor.

 

F4BME utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.

 

By precisely adjusting the ratio of PTFE resin to glass fabric, the F4BM and F4BME series achieve targeted dielectric constants while maintaining low loss and enhanced dimensional stability. Higher dielectric constant grades contain a higher proportion of glass, resulting in improved dimensional stability, a lower coefficient of thermal expansion (CTE), and better temperature drift characteristics, though with a marginal increase in dielectric loss.

 

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet 0

 

Product Features
◈DK2.17~3 is optional, and DK can be customized

◈ Low loss
◈ F4BME paired with RTF copper foil provides excellent PIM performance
◈ Diverse size options for cost savings
◈ Radiation resistant, low outgassing
◈ Commercial availability, mass production capability, high cost-performance ratio

 

Typical Applications
◈ Microwave, Radio Frequency, Radar
◈ Phase shifters, passive components
◈ Power dividers, couplers, combiners
◈ Feed networks, phased array antennas
◈ Satellite communications, base station antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME265
Dielectric Constant (Typical) 10GHz / 2.65
Dielectric Constant Tolerance / / ±0.05
Loss Tangent (Typical) 10GHz / 0.0013
20GHz / 0.0019
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -100
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction)

5KW,500V/s

 

KV/mm >25
Breakdown Voltage (XY direction) 5KW,500V/s KV >34
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 14, 17
Z direction -55 º~288ºC ppm/ºC 142
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.25
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.36
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet 1

prodotti
Dettagli dei prodotti
F4BME265 Substrate High Frequency Laminates Copper Clad Sheet
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Numero di parte:
F4BME265
Spessore laminato:
0,1 - 12 mm
Dimensioni del laminato:
460X610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840m
Peso del rame:
0,5 once (0,018 mm); 1 oncia (0,035 mm);
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchetti sottovuoto+Cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000 pezzi al mese
Evidenziare

F4BME265 high frequency copper laminate

,

copper clad sheet substrate

,

high frequency laminates with warranty

Descrizione del prodotto

The F4BME265 is a high-frequency laminate manufactured through a precisely controlled process using woven glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film. Offering enhanced electrical performance compared to standard F4B materials, it features a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, making it a reliable alternative to equivalent foreign products.

 

The F4BM and F4BME series share an identical dielectric core but are differentiated by their copper foil type:

 

F4BM is paired with ED (electrodeposited) copper foil, designed for applications where Passive Intermodulation (PIM) is not a critical factor.

 

F4BME utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.

 

By precisely adjusting the ratio of PTFE resin to glass fabric, the F4BM and F4BME series achieve targeted dielectric constants while maintaining low loss and enhanced dimensional stability. Higher dielectric constant grades contain a higher proportion of glass, resulting in improved dimensional stability, a lower coefficient of thermal expansion (CTE), and better temperature drift characteristics, though with a marginal increase in dielectric loss.

 

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet 0

 

Product Features
◈DK2.17~3 is optional, and DK can be customized

◈ Low loss
◈ F4BME paired with RTF copper foil provides excellent PIM performance
◈ Diverse size options for cost savings
◈ Radiation resistant, low outgassing
◈ Commercial availability, mass production capability, high cost-performance ratio

 

Typical Applications
◈ Microwave, Radio Frequency, Radar
◈ Phase shifters, passive components
◈ Power dividers, couplers, combiners
◈ Feed networks, phased array antennas
◈ Satellite communications, base station antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME265
Dielectric Constant (Typical) 10GHz / 2.65
Dielectric Constant Tolerance / / ±0.05
Loss Tangent (Typical) 10GHz / 0.0013
20GHz / 0.0019
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -100
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction)

5KW,500V/s

 

KV/mm >25
Breakdown Voltage (XY direction) 5KW,500V/s KV >34
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 14, 17
Z direction -55 º~288ºC ppm/ºC 142
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.25
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.36
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet 1

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