| MOQ: | 1pcs |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchi a vuoto+cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/t |
| Capacità di approvvigionamento: | 5000pcs al mese |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer |
| Board Dimensions | 49mm x 27mm = 1PCS |
| Minimum Trace/Space | 4/5 mils, enabling precise routing in compact designs without compromising signal integrity |
| Minimum Hole Size | 0.2mm, accommodating small components for space-efficient layouts |
| Finished Thickness | 0.2mm, ultra-thin design suitable for applications with strict space constraints |
| Outer Cu Weight | 1oz (1.4 mils), ensuring reliable conductivity for various current requirements |
| Via Plating | 20μm thick, enhancing interlayer connection durability against thermal and mechanical stress |
| Surface Finish | ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability |
| Silkscreen | White on top (clear component identification), none on bottom (simplified design) |
| Solder Mask | None on top or bottom, tailored for specific application needs |
| Electrical Test | 100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality |
| Layer | Material/Component | Thickness |
|---|---|---|
| Copper_layer_1 | Copper | 35μm |
| Substrate | Rogers RO3010 | 5mil (0.127mm) |
| Copper_layer_2 | Copper | 35μm |
| MOQ: | 1pcs |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchi a vuoto+cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/t |
| Capacità di approvvigionamento: | 5000pcs al mese |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer |
| Board Dimensions | 49mm x 27mm = 1PCS |
| Minimum Trace/Space | 4/5 mils, enabling precise routing in compact designs without compromising signal integrity |
| Minimum Hole Size | 0.2mm, accommodating small components for space-efficient layouts |
| Finished Thickness | 0.2mm, ultra-thin design suitable for applications with strict space constraints |
| Outer Cu Weight | 1oz (1.4 mils), ensuring reliable conductivity for various current requirements |
| Via Plating | 20μm thick, enhancing interlayer connection durability against thermal and mechanical stress |
| Surface Finish | ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability |
| Silkscreen | White on top (clear component identification), none on bottom (simplified design) |
| Solder Mask | None on top or bottom, tailored for specific application needs |
| Electrical Test | 100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality |
| Layer | Material/Component | Thickness |
|---|---|---|
| Copper_layer_1 | Copper | 35μm |
| Substrate | Rogers RO3010 | 5mil (0.127mm) |
| Copper_layer_2 | Copper | 35μm |