logo
prodotti
Dettagli dei prodotti
Casa. > prodotti >
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
prodotti

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo
Contattaci
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contattaci ora
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Nome

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Dettagli Informazioni
Descrizione del prodotto
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO4350B a basso profilo (LoPro)
Conta dei strati:
2 strati
Spessore del PCB:
1,6 mm
Dimensioni del circuito stampato:
43 mm x 56 mm per pezzo (1 pezzo)
Silkscreen:
Bianco
Maschera di saldatura:
Verde
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
ENEPIG (Nichel Elettronico, Palladio Elettrolitico e Oro ad Immersione)
Evidenziare:

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Descrizione del prodotto
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tag: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

Prodotti raccomandati
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

Contattaci ora
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Contattaci ora
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Contattaci ora
Rogers RT duroid 5880 PCB 1.6mm Double-Sided RF Circuit Board

Rogers RT duroid 5880 PCB 1.6mm Double-Sided RF Circuit Board

Contattaci ora
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

Contattaci ora
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Contattaci ora
2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

Contattaci ora
prodotti
Dettagli dei prodotti
prodotti

Bordo del PWB di rf

Bordo del PWB di Rogers

Bordo del PWB di PTFE

Alto PWB di Tg

Multi PWB di strato

PWB Taconic

Bordo del PWB di HDI

PWB ad alta velocità

L'impedenza ha controllato il PWB

Bordo flessibile del PWB

bordo del PWB fr4

stampino del PWB

PWB del centro del metallo
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Nome
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Informazioni dettagliate
Descrizione del prodotto
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO4350B a basso profilo (LoPro)
Conta dei strati:
2 strati
Spessore del PCB:
1,6 mm
Dimensioni del circuito stampato:
43 mm x 56 mm per pezzo (1 pezzo)
Silkscreen:
Bianco
Maschera di saldatura:
Verde
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
ENEPIG (Nichel Elettronico, Palladio Elettrolitico e Oro ad Immersione)
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchi a vuoto+cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000pcs al mese
Evidenziare

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Descrizione del prodotto
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tag: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, Cina 518103
Tel: 86-755-27374946
Mappa del sito |  Politica sulla privacy | La Cina va bene. Qualità Bordo del PWB di rf Fornitore. 2020-2025 Bicheng Electronics Technology Co., Ltd Tutti. Tutti i diritti riservati.