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Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO3010
Conta dei strati:
2 strati
Spessore del PCB:
0,8 mm
Dimensioni del circuito stampato:
45 mm x 65 mm (1 pezzo)
Silkscreen:
Nero
Maschera di saldatura:
NO
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
oro di immersione
Evidenziare:

Rogers RO3010 PCB board

,

double-layer PCB board 25mil

,

Rogers high-frequency PCB

Descrizione del prodotto
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board
Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010--a ceramic-filled PTFE composite material--to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.
PCB Specification
Parameter Specification
Layer Count 2-layer rigid PCB
Base Material Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions 45mm x 65mm (1 piece)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils / 35μm)
Via Plating Thickness 20μm
Minimum Trace/Space 4 mils / 4 mils
Minimum Hole Size 0.3mm
Vias 12 total (no blind vias)
Surface Finish Immersion Gold
Silkscreen Top: Black; Bottom: No
Solder Mask Top: No; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up (Top to Bottom)
Layer Sequence Layer Type Specification Thickness
1 Copper Layer (Top - L1) Copper_layer_1 35μm (1oz)
2 Substrate Rogers RO3010 0.635mm (25mil)
3 Copper Layer (Bottom - L2) Copper_layer_2 35μm (1oz)
Rogers RO3010 Material Overview
Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization-- a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board 0
Key Features of Rogers RO3010
Property Specification
Dielectric Constant (Dk) 10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df) 0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE) X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td) >500°C
Thermal Conductivity 0.95 W/mK
Moisture Absorption 0.05%
Operating Temperature Range -40°C to +85°C
Quality Certification ISO 9001 Certified
Core Benefits of Rogers RO3010
  • Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
  • Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
  • Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
  • Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
  • Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.
Typical Applications
This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:
  • Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
  • Global Positioning System (GPS) antennas
  • Cellular telecommunications systems (power amplifiers, antennas)
  • Patch antennas for wireless communications
  • Direct broadcast satellite (DBS) equipment
  • Cable system datalinks
  • Remote meter readers
  • Power backplanes
Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board 1
prodotti
Dettagli dei prodotti
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchi a vuoto+cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000pcs al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-332.V1.0
Materiale di base:
Rogers RO3010
Conta dei strati:
2 strati
Spessore del PCB:
0,8 mm
Dimensioni del circuito stampato:
45 mm x 65 mm (1 pezzo)
Silkscreen:
Nero
Maschera di saldatura:
NO
Peso di rame:
1 oncia (1,4 mil) per gli strati esterni
Finitura superficiale:
oro di immersione
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchi a vuoto+cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000pcs al mese
Evidenziare

Rogers RO3010 PCB board

,

double-layer PCB board 25mil

,

Rogers high-frequency PCB

Descrizione del prodotto
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board
Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010--a ceramic-filled PTFE composite material--to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.
PCB Specification
Parameter Specification
Layer Count 2-layer rigid PCB
Base Material Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions 45mm x 65mm (1 piece)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils / 35μm)
Via Plating Thickness 20μm
Minimum Trace/Space 4 mils / 4 mils
Minimum Hole Size 0.3mm
Vias 12 total (no blind vias)
Surface Finish Immersion Gold
Silkscreen Top: Black; Bottom: No
Solder Mask Top: No; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up (Top to Bottom)
Layer Sequence Layer Type Specification Thickness
1 Copper Layer (Top - L1) Copper_layer_1 35μm (1oz)
2 Substrate Rogers RO3010 0.635mm (25mil)
3 Copper Layer (Bottom - L2) Copper_layer_2 35μm (1oz)
Rogers RO3010 Material Overview
Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization-- a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board 0
Key Features of Rogers RO3010
Property Specification
Dielectric Constant (Dk) 10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df) 0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE) X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td) >500°C
Thermal Conductivity 0.95 W/mK
Moisture Absorption 0.05%
Operating Temperature Range -40°C to +85°C
Quality Certification ISO 9001 Certified
Core Benefits of Rogers RO3010
  • Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
  • Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
  • Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
  • Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
  • Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.
Typical Applications
This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:
  • Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
  • Global Positioning System (GPS) antennas
  • Cellular telecommunications systems (power amplifiers, antennas)
  • Patch antennas for wireless communications
  • Direct broadcast satellite (DBS) equipment
  • Cable system datalinks
  • Remote meter readers
  • Power backplanes
Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.
Rogers RO3010 PCB 25mil Thick Double-layer pcb Board 1
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