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2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen

2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-470.V1.0
Materiale di base:
Rogers RO4730G3
Conteggio degli strati:
2 strati
Spessore del PCB:
0,6 mm
Dimensioni del circuito stampato:
85,6 mm x 103 mm per unità, con una tolleranza dimensionale di +/- 0,15 mm
Maschera per saldatura:
blu
Serigrafia:
Bianco
Peso del rame:
1 oncia
Finitura superficiale:
ENEPIG (Oro ad immersione in palladio elettrolitico al nichel chimico)
Evidenziare:

2-layer Rogers RO4730G3 PCB

,

20mil thick blue solder-mask PCB

,

white silkscreen Rogers PCB board

Descrizione del prodotto

This PCB is a high-frequency 2-layer rigid printed circuit board using Rogers RO4730G3, a premium antenna-grade laminate engineered for high-frequency applications. It leverages the material’s stable dielectric constant and low dissipation factor to ensure superior signal integrity, delivering low signal loss and consistent performance—critical for cellular base station antennas and reliable communication efficiency.

 

PCB Construction Details

Item Specifications
Base Material Rogers RO4730G3 (Hydrocarbon/Ceramic/Woven Glass Composite)
Layer Count 2 layers (no blind vias included)
Board Dimensions 85.6mm x 103mm per unit, with a dimensional tolerance of +/- 0.15mm
Minimum Trace/Space 4 mil trace width / 6 mil spacing
Minimum Hole Size 0.3mm
Finished Board Thickness 0.6mm
Finished Copper Weight 1 oz (equivalent to 1.4 mils) for outer copper layers
Via Plating Thickness 20 μm
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
Top Silkscreen White
Bottom Silkscreen Not applied
Top Solder Mask Blue
Bottom Solder Mask Not applied
Quality Control 100% electrical testing performed before shipment

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm
- Rogers RO4730G3 Core (Dielectric Layer) 0.508 mm (20 mil)
2 Copper Layer 2 (Outer Bottom) 35 μm

 

2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen 0

 

Artwork, Quality Standard and Availability

In terms of artwork, quality, and availability, the PCB is supplied with artwork in the Gerber RS-274-X format—an industry standard for PCB manufacturing that ensures compatibility with most mainstream production equipment. The PCB meets the IPC-Class-2 quality standard, a widely accepted benchmark that ensures consistent performance and manufacturing quality. Furthermore, this PCB is available for shipping worldwide, making it suitable for international projects.

 

Introduction to Rogers RO4730G3 Material

Rogers RO4730G3 is an antenna-grade laminate with a UL 94 V-0 flammability rating, composed of hydrocarbon, ceramic, and woven glass. It acts as a reliable, cost-efficient alternative to traditional PTFE-based laminates, with resin systems that provide the key properties needed for optimal antenna performance. Fully compatible with standard FR-4 processing and high-temperature lead-free soldering, RO4730G3 eliminates the need for special plated through-hole (PTH) preparation that is required for conventional PTFE materials. This makes it an economical choice for antenna applications, allowing designers to effectively balance performance and cost.

 

Key Features of Rogers RO4730G3 Material

Key Features Specifications
Dielectric Constant (Dk) 3.0 +/- 0.05 at 10GHz
Dissipation Factor 0.0028 at 10GHz
Thermal Coefficient of Dk (TCDk) 34 ppm/°C
Coefficient of Thermal Expansion (CTE) X-axis: 15.9 ppm/°C; Y-axis: 14.4 ppm/°C; Z-axis: 35.2 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) Greater than 280 °C
Decomposition Temperature (Td) 411 °C (measured via TGA)
Thermal Conductivity 0.45 W/mk

 

Benefits of Rogers RO4730G3 Material

-Low-loss dielectric paired with low-profile foil, which reduces Passive Intermodulation (PIM) and minimizes insertion loss.

 

-Unique filler and closed microsphere structure, offering low density and a 30% weight reduction compared to PTFE/Glass alternatives.

 

-Low Z-axis CTE (<30 ppm/°C) and high Tg (>280°C), providing greater design flexibility and compatibility with automated assembly processes.

 

-Low TCDk (<40 ppm/°C), ensuring consistent circuit performance across varying temperature conditions.

 

-Specialized thermoset resin system and filler, delivering low TCDk, a 3.0 Dk value, ease of fabrication, and plated through-hole (PTH) process capability.

 

-Environmentally sustainable, with compatibility for lead-free processing and compliance with RoHS standards.

 

Typical Applications

With its excellent electrical performance and cost-effectiveness, this PCB is specifically engineered for use in:

 

-Cellular Base Station Antennas

 

Conclusion

This 2-layer rigid PCB, constructed from Rogers RO4730G3 antenna-grade laminate, combines strong electrical performance, cost-efficiency, and dependable manufacturability.

 

The inherent advantages of Rogers RO4730G3—including low dielectric loss, stable Dk, lightweight design, and lead-free compatibility—boost the PCB’s competitiveness. As a cost-effective alternative to traditional PTFE laminates, it is well-suited for cellular base station antennas and other high-frequency applications, with worldwide availability to meet the needs of global projects.

 

2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen 1

prodotti
Dettagli dei prodotti
2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-470.V1.0
Materiale di base:
Rogers RO4730G3
Conteggio degli strati:
2 strati
Spessore del PCB:
0,6 mm
Dimensioni del circuito stampato:
85,6 mm x 103 mm per unità, con una tolleranza dimensionale di +/- 0,15 mm
Maschera per saldatura:
blu
Serigrafia:
Bianco
Peso del rame:
1 oncia
Finitura superficiale:
ENEPIG (Oro ad immersione in palladio elettrolitico al nichel chimico)
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchetti sottovuoto+Cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000 pezzi al mese
Evidenziare

2-layer Rogers RO4730G3 PCB

,

20mil thick blue solder-mask PCB

,

white silkscreen Rogers PCB board

Descrizione del prodotto

This PCB is a high-frequency 2-layer rigid printed circuit board using Rogers RO4730G3, a premium antenna-grade laminate engineered for high-frequency applications. It leverages the material’s stable dielectric constant and low dissipation factor to ensure superior signal integrity, delivering low signal loss and consistent performance—critical for cellular base station antennas and reliable communication efficiency.

 

PCB Construction Details

Item Specifications
Base Material Rogers RO4730G3 (Hydrocarbon/Ceramic/Woven Glass Composite)
Layer Count 2 layers (no blind vias included)
Board Dimensions 85.6mm x 103mm per unit, with a dimensional tolerance of +/- 0.15mm
Minimum Trace/Space 4 mil trace width / 6 mil spacing
Minimum Hole Size 0.3mm
Finished Board Thickness 0.6mm
Finished Copper Weight 1 oz (equivalent to 1.4 mils) for outer copper layers
Via Plating Thickness 20 μm
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
Top Silkscreen White
Bottom Silkscreen Not applied
Top Solder Mask Blue
Bottom Solder Mask Not applied
Quality Control 100% electrical testing performed before shipment

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm
- Rogers RO4730G3 Core (Dielectric Layer) 0.508 mm (20 mil)
2 Copper Layer 2 (Outer Bottom) 35 μm

 

2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen 0

 

Artwork, Quality Standard and Availability

In terms of artwork, quality, and availability, the PCB is supplied with artwork in the Gerber RS-274-X format—an industry standard for PCB manufacturing that ensures compatibility with most mainstream production equipment. The PCB meets the IPC-Class-2 quality standard, a widely accepted benchmark that ensures consistent performance and manufacturing quality. Furthermore, this PCB is available for shipping worldwide, making it suitable for international projects.

 

Introduction to Rogers RO4730G3 Material

Rogers RO4730G3 is an antenna-grade laminate with a UL 94 V-0 flammability rating, composed of hydrocarbon, ceramic, and woven glass. It acts as a reliable, cost-efficient alternative to traditional PTFE-based laminates, with resin systems that provide the key properties needed for optimal antenna performance. Fully compatible with standard FR-4 processing and high-temperature lead-free soldering, RO4730G3 eliminates the need for special plated through-hole (PTH) preparation that is required for conventional PTFE materials. This makes it an economical choice for antenna applications, allowing designers to effectively balance performance and cost.

 

Key Features of Rogers RO4730G3 Material

Key Features Specifications
Dielectric Constant (Dk) 3.0 +/- 0.05 at 10GHz
Dissipation Factor 0.0028 at 10GHz
Thermal Coefficient of Dk (TCDk) 34 ppm/°C
Coefficient of Thermal Expansion (CTE) X-axis: 15.9 ppm/°C; Y-axis: 14.4 ppm/°C; Z-axis: 35.2 ppm/°C (matched to copper)
Glass Transition Temperature (Tg) Greater than 280 °C
Decomposition Temperature (Td) 411 °C (measured via TGA)
Thermal Conductivity 0.45 W/mk

 

Benefits of Rogers RO4730G3 Material

-Low-loss dielectric paired with low-profile foil, which reduces Passive Intermodulation (PIM) and minimizes insertion loss.

 

-Unique filler and closed microsphere structure, offering low density and a 30% weight reduction compared to PTFE/Glass alternatives.

 

-Low Z-axis CTE (<30 ppm/°C) and high Tg (>280°C), providing greater design flexibility and compatibility with automated assembly processes.

 

-Low TCDk (<40 ppm/°C), ensuring consistent circuit performance across varying temperature conditions.

 

-Specialized thermoset resin system and filler, delivering low TCDk, a 3.0 Dk value, ease of fabrication, and plated through-hole (PTH) process capability.

 

-Environmentally sustainable, with compatibility for lead-free processing and compliance with RoHS standards.

 

Typical Applications

With its excellent electrical performance and cost-effectiveness, this PCB is specifically engineered for use in:

 

-Cellular Base Station Antennas

 

Conclusion

This 2-layer rigid PCB, constructed from Rogers RO4730G3 antenna-grade laminate, combines strong electrical performance, cost-efficiency, and dependable manufacturability.

 

The inherent advantages of Rogers RO4730G3—including low dielectric loss, stable Dk, lightweight design, and lead-free compatibility—boost the PCB’s competitiveness. As a cost-effective alternative to traditional PTFE laminates, it is well-suited for cellular base station antennas and other high-frequency applications, with worldwide availability to meet the needs of global projects.

 

2-layer RO4730G3 PCB 20mil Thick Blue Solder-mask White Silkscreen 1

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