logo
prodotti
Dettagli dei prodotti
Casa. > prodotti >
RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask

RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask

MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-470.V1.0
Materiale di base:
Duroide RT 6010.2LM
Conteggio degli strati:
4 strati
Spessore del PCB:
2,8 mm
Dimensioni del circuito stampato:
86 mm x 103 mm per pezzo
Maschera per saldatura:
verde
Serigrafia:
Bianco
Peso del rame:
1 oncia (equivalente a 1,4 mil) per tutti gli strati
Finitura superficiale:
ENIG (oro a immersione in nichel senza elettro)
Evidenziare:

RT duroid 6010.2LM 4-layer PCB

,

2.8mm thick green solder-mask PCB

,

multi-layer PCB with solder-mask

Descrizione del prodotto

This PCB is a high-performance 4-layer rigid printed circuit board (PCB) fabricated with Rogers RT duroid 6010.2LM, a ceramic-PTFE composite microwave laminate engineered for electronic and microwave circuit applications requiring a high dielectric constant. Leveraging the material’s high Dk, low loss, and tight dimensional control, the PCB enables circuit size reduction while ensuring repeatable performance, making it well-suited for X-band and below applications such as patch antennas and satellite communications systems.

 

PCB Specifications

Item Specifications
Base Material RT duroid 6010.2LM (Ceramic-PTFE Composite Microwave Laminate)
Layer Count 4 layers (no blind vias included)
Board Dimensions 86mm x 103mm per piece, with a dimensional tolerance of +/- 0.15mm
Minimum Trace/Space 5 mil trace width with 7 mil spacing
Minimum Hole Size 0.5mm
Finished Board Thickness 2.8mm
Finished Copper Weight 1 oz (equivalent to 1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Top Silkscreen White
Bottom Silkscreen Not applied
Top Solder Mask Green
Bottom Solder Mask Not applied
Quality Control 100% electrical testing performed prior to shipment

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm
- Rogers RT duroid 6010.2LM Core 1.27 mm (50 mil)
2 Copper Layer 2 35 μm
- Prepreg 0.102 mm
3 Copper Layer 3 35 μm
- Rogers RT duroid 6010.2LM Core 1.27 mm (50 mil)
4 Copper Layer 4 (Outer Bottom) 35 μm

 

Artwork, Quality Standard and Availability

The PCB is supplied with artwork in the Gerber RS-274-X format, the industry-standard format for PCB fabrication.

 

It adheres to the IPC-Class-2 quality standard, a globally recognized benchmark that guarantees consistent performance, reliable manufacturing quality, and compliance with industry requirements.

 

Additionally, this PCB is available worldwide, catering to the needs of international clients and microwave circuit projects across the globe.

 

RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask 0

 

Introduction to RT duroid 6010.2LM Material

RT/duroid 6010LM microwave laminates are ceramic-PTFE composite materials specifically designed for electronic and microwave circuit applications that require a high dielectric constant. RT/duroid 6010.2LM laminates offer a high dielectric constant (Dk) to enable significant circuit size reduction, while maintaining low loss characteristics—making them ideal for operations at X-band or below. Furthermore, their tight Dk and thickness control ensure repeatable circuit performance, critical for high-reliability microwave applications.

 

Key Features of RT duroid 6010.2LM Material

Key Features Specifications
Dielectric Constant (Dk) 10.2 +/- 0.25
Dissipation Factor 0.0023 at 10 GHz
Coefficient of Thermal Expansion (CTE) X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C (matched to copper)
Decomposition Temperature (Td) 500 °C (measured via TGA)
Thermal Conductivity 0.86 W/mk
Flammability UL 94 V0 standard
Copper Foil Clad with standard and reverse treated electrodeposited copper foil

 

Benefits of RT duroid 6010.2LM Material

-High dielectric constant enables significant circuit size reduction, optimizing space utilization in compact electronic systems.

 

-Low loss characteristics make it ideal for operating at X-band or below, ensuring minimal signal attenuation and high signal integrity.

 

-Tight Dk and thickness control guarantees repeatable circuit performance, critical for high-reliability microwave applications.

 

-Low moisture absorption enhances long-term reliability and stability in varying environmental conditions.

 

-Enables reliable plated through-holes in multi-layer boards, ensuring robust interlayer connectivity and mechanical durability.

 

Typical Applications

Leveraging its high Dk, low loss, and repeatable performance, this PCB is specifically engineered for the following microwave and high-reliability applications:

 

-Patch Antennas

-Satellite Communications Systems

-Power Amplifiers

-Aircraft Collision Avoidance Systems

-Ground Radar Warning Systems

 

Conclusion

This 4-layer rigid PCB, fabricated using Rogers RT duroid 6010.2LM ceramic-PTFE composite microwave laminate, integrates superior dielectric performance, low-loss characteristics, and robust structural reliability, which are critical for high-reliability microwave applications.

 

The intrinsic advantages of RT duroid 6010.2LM—including a high dielectric constant (Dk) for circuit miniaturization, low loss for X-band and below operations, tight dimensional and Dk control, and reliable plated through-holes—position this PCB as a high-performance solution for microwave and aerospace-related applications.

 

RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask 1

prodotti
Dettagli dei prodotti
RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask
MOQ: 1 pz
prezzo: USD9.99-99.99
Imballaggio standard: Sacchetti sottovuoto+Cartoni
Periodo di consegna: 8-9 giorni lavorativi
Metodo di pagamento: T/T
Capacità di approvvigionamento: 5000 pezzi al mese
Informazioni dettagliate
Luogo di origine
Cina
Marca
Bicheng
Certificazione
UL, ISO9001, IATF16949
Numero di modello
BIC-470.V1.0
Materiale di base:
Duroide RT 6010.2LM
Conteggio degli strati:
4 strati
Spessore del PCB:
2,8 mm
Dimensioni del circuito stampato:
86 mm x 103 mm per pezzo
Maschera per saldatura:
verde
Serigrafia:
Bianco
Peso del rame:
1 oncia (equivalente a 1,4 mil) per tutti gli strati
Finitura superficiale:
ENIG (oro a immersione in nichel senza elettro)
Quantità di ordine minimo:
1 pz
Prezzo:
USD9.99-99.99
Imballaggi particolari:
Sacchetti sottovuoto+Cartoni
Tempi di consegna:
8-9 giorni lavorativi
Termini di pagamento:
T/T
Capacità di alimentazione:
5000 pezzi al mese
Evidenziare

RT duroid 6010.2LM 4-layer PCB

,

2.8mm thick green solder-mask PCB

,

multi-layer PCB with solder-mask

Descrizione del prodotto

This PCB is a high-performance 4-layer rigid printed circuit board (PCB) fabricated with Rogers RT duroid 6010.2LM, a ceramic-PTFE composite microwave laminate engineered for electronic and microwave circuit applications requiring a high dielectric constant. Leveraging the material’s high Dk, low loss, and tight dimensional control, the PCB enables circuit size reduction while ensuring repeatable performance, making it well-suited for X-band and below applications such as patch antennas and satellite communications systems.

 

PCB Specifications

Item Specifications
Base Material RT duroid 6010.2LM (Ceramic-PTFE Composite Microwave Laminate)
Layer Count 4 layers (no blind vias included)
Board Dimensions 86mm x 103mm per piece, with a dimensional tolerance of +/- 0.15mm
Minimum Trace/Space 5 mil trace width with 7 mil spacing
Minimum Hole Size 0.5mm
Finished Board Thickness 2.8mm
Finished Copper Weight 1 oz (equivalent to 1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Top Silkscreen White
Bottom Silkscreen Not applied
Top Solder Mask Green
Bottom Solder Mask Not applied
Quality Control 100% electrical testing performed prior to shipment

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm
- Rogers RT duroid 6010.2LM Core 1.27 mm (50 mil)
2 Copper Layer 2 35 μm
- Prepreg 0.102 mm
3 Copper Layer 3 35 μm
- Rogers RT duroid 6010.2LM Core 1.27 mm (50 mil)
4 Copper Layer 4 (Outer Bottom) 35 μm

 

Artwork, Quality Standard and Availability

The PCB is supplied with artwork in the Gerber RS-274-X format, the industry-standard format for PCB fabrication.

 

It adheres to the IPC-Class-2 quality standard, a globally recognized benchmark that guarantees consistent performance, reliable manufacturing quality, and compliance with industry requirements.

 

Additionally, this PCB is available worldwide, catering to the needs of international clients and microwave circuit projects across the globe.

 

RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask 0

 

Introduction to RT duroid 6010.2LM Material

RT/duroid 6010LM microwave laminates are ceramic-PTFE composite materials specifically designed for electronic and microwave circuit applications that require a high dielectric constant. RT/duroid 6010.2LM laminates offer a high dielectric constant (Dk) to enable significant circuit size reduction, while maintaining low loss characteristics—making them ideal for operations at X-band or below. Furthermore, their tight Dk and thickness control ensure repeatable circuit performance, critical for high-reliability microwave applications.

 

Key Features of RT duroid 6010.2LM Material

Key Features Specifications
Dielectric Constant (Dk) 10.2 +/- 0.25
Dissipation Factor 0.0023 at 10 GHz
Coefficient of Thermal Expansion (CTE) X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C (matched to copper)
Decomposition Temperature (Td) 500 °C (measured via TGA)
Thermal Conductivity 0.86 W/mk
Flammability UL 94 V0 standard
Copper Foil Clad with standard and reverse treated electrodeposited copper foil

 

Benefits of RT duroid 6010.2LM Material

-High dielectric constant enables significant circuit size reduction, optimizing space utilization in compact electronic systems.

 

-Low loss characteristics make it ideal for operating at X-band or below, ensuring minimal signal attenuation and high signal integrity.

 

-Tight Dk and thickness control guarantees repeatable circuit performance, critical for high-reliability microwave applications.

 

-Low moisture absorption enhances long-term reliability and stability in varying environmental conditions.

 

-Enables reliable plated through-holes in multi-layer boards, ensuring robust interlayer connectivity and mechanical durability.

 

Typical Applications

Leveraging its high Dk, low loss, and repeatable performance, this PCB is specifically engineered for the following microwave and high-reliability applications:

 

-Patch Antennas

-Satellite Communications Systems

-Power Amplifiers

-Aircraft Collision Avoidance Systems

-Ground Radar Warning Systems

 

Conclusion

This 4-layer rigid PCB, fabricated using Rogers RT duroid 6010.2LM ceramic-PTFE composite microwave laminate, integrates superior dielectric performance, low-loss characteristics, and robust structural reliability, which are critical for high-reliability microwave applications.

 

The intrinsic advantages of RT duroid 6010.2LM—including a high dielectric constant (Dk) for circuit miniaturization, low loss for X-band and below operations, tight dimensional and Dk control, and reliable plated through-holes—position this PCB as a high-performance solution for microwave and aerospace-related applications.

 

RT duroid 6010.2LM PCB 4-layer 2.8mm Thick Green Solder-mask 1

Mappa del sito |  Politica sulla privacy | La Cina va bene. Qualità Bordo del PWB di rf Fornitore. 2020-2026 Bicheng Electronics Technology Co., Ltd Tutti. Tutti i diritti riservati.