| MOQ: | 1 pz |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchetti sottovuoto+Cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/T |
| Capacità di approvvigionamento: | 5000 pezzi al mese |
This PCB is a high-performance 4-layer rigid printed circuit board (PCB) fabricated with Rogers RT duroid 6010.2LM, a ceramic-PTFE composite microwave laminate engineered for electronic and microwave circuit applications requiring a high dielectric constant. Leveraging the material’s high Dk, low loss, and tight dimensional control, the PCB enables circuit size reduction while ensuring repeatable performance, making it well-suited for X-band and below applications such as patch antennas and satellite communications systems.
PCB Specifications
| Item | Specifications |
| Base Material | RT duroid 6010.2LM (Ceramic-PTFE Composite Microwave Laminate) |
| Layer Count | 4 layers (no blind vias included) |
| Board Dimensions | 86mm x 103mm per piece, with a dimensional tolerance of +/- 0.15mm |
| Minimum Trace/Space | 5 mil trace width with 7 mil spacing |
| Minimum Hole Size | 0.5mm |
| Finished Board Thickness | 2.8mm |
| Finished Copper Weight | 1 oz (equivalent to 1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Green |
| Bottom Solder Mask | Not applied |
| Quality Control | 100% electrical testing performed prior to shipment |
PCB Stack-up
| Layer | Description | Thickness |
| 1 | Copper Layer 1 (Outer Top) | 35 μm |
| - | Rogers RT duroid 6010.2LM Core | 1.27 mm (50 mil) |
| 2 | Copper Layer 2 | 35 μm |
| - | Prepreg | 0.102 mm |
| 3 | Copper Layer 3 | 35 μm |
| - | Rogers RT duroid 6010.2LM Core | 1.27 mm (50 mil) |
| 4 | Copper Layer 4 (Outer Bottom) | 35 μm |
Artwork, Quality Standard and Availability
The PCB is supplied with artwork in the Gerber RS-274-X format, the industry-standard format for PCB fabrication.
It adheres to the IPC-Class-2 quality standard, a globally recognized benchmark that guarantees consistent performance, reliable manufacturing quality, and compliance with industry requirements.
Additionally, this PCB is available worldwide, catering to the needs of international clients and microwave circuit projects across the globe.
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Introduction to RT duroid 6010.2LM Material
RT/duroid 6010LM microwave laminates are ceramic-PTFE composite materials specifically designed for electronic and microwave circuit applications that require a high dielectric constant. RT/duroid 6010.2LM laminates offer a high dielectric constant (Dk) to enable significant circuit size reduction, while maintaining low loss characteristics—making them ideal for operations at X-band or below. Furthermore, their tight Dk and thickness control ensure repeatable circuit performance, critical for high-reliability microwave applications.
Key Features of RT duroid 6010.2LM Material
| Key Features | Specifications |
| Dielectric Constant (Dk) | 10.2 +/- 0.25 |
| Dissipation Factor | 0.0023 at 10 GHz |
| Coefficient of Thermal Expansion (CTE) | X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C (matched to copper) |
| Decomposition Temperature (Td) | 500 °C (measured via TGA) |
| Thermal Conductivity | 0.86 W/mk |
| Flammability | UL 94 V0 standard |
| Copper Foil | Clad with standard and reverse treated electrodeposited copper foil |
Benefits of RT duroid 6010.2LM Material
-High dielectric constant enables significant circuit size reduction, optimizing space utilization in compact electronic systems.
-Low loss characteristics make it ideal for operating at X-band or below, ensuring minimal signal attenuation and high signal integrity.
-Tight Dk and thickness control guarantees repeatable circuit performance, critical for high-reliability microwave applications.
-Low moisture absorption enhances long-term reliability and stability in varying environmental conditions.
-Enables reliable plated through-holes in multi-layer boards, ensuring robust interlayer connectivity and mechanical durability.
Typical Applications
Leveraging its high Dk, low loss, and repeatable performance, this PCB is specifically engineered for the following microwave and high-reliability applications:
-Patch Antennas
-Satellite Communications Systems
-Power Amplifiers
-Aircraft Collision Avoidance Systems
-Ground Radar Warning Systems
Conclusion
This 4-layer rigid PCB, fabricated using Rogers RT duroid 6010.2LM ceramic-PTFE composite microwave laminate, integrates superior dielectric performance, low-loss characteristics, and robust structural reliability, which are critical for high-reliability microwave applications.
The intrinsic advantages of RT duroid 6010.2LM—including a high dielectric constant (Dk) for circuit miniaturization, low loss for X-band and below operations, tight dimensional and Dk control, and reliable plated through-holes—position this PCB as a high-performance solution for microwave and aerospace-related applications.
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| MOQ: | 1 pz |
| prezzo: | USD9.99-99.99 |
| Imballaggio standard: | Sacchetti sottovuoto+Cartoni |
| Periodo di consegna: | 8-9 giorni lavorativi |
| Metodo di pagamento: | T/T |
| Capacità di approvvigionamento: | 5000 pezzi al mese |
This PCB is a high-performance 4-layer rigid printed circuit board (PCB) fabricated with Rogers RT duroid 6010.2LM, a ceramic-PTFE composite microwave laminate engineered for electronic and microwave circuit applications requiring a high dielectric constant. Leveraging the material’s high Dk, low loss, and tight dimensional control, the PCB enables circuit size reduction while ensuring repeatable performance, making it well-suited for X-band and below applications such as patch antennas and satellite communications systems.
PCB Specifications
| Item | Specifications |
| Base Material | RT duroid 6010.2LM (Ceramic-PTFE Composite Microwave Laminate) |
| Layer Count | 4 layers (no blind vias included) |
| Board Dimensions | 86mm x 103mm per piece, with a dimensional tolerance of +/- 0.15mm |
| Minimum Trace/Space | 5 mil trace width with 7 mil spacing |
| Minimum Hole Size | 0.5mm |
| Finished Board Thickness | 2.8mm |
| Finished Copper Weight | 1 oz (equivalent to 1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Green |
| Bottom Solder Mask | Not applied |
| Quality Control | 100% electrical testing performed prior to shipment |
PCB Stack-up
| Layer | Description | Thickness |
| 1 | Copper Layer 1 (Outer Top) | 35 μm |
| - | Rogers RT duroid 6010.2LM Core | 1.27 mm (50 mil) |
| 2 | Copper Layer 2 | 35 μm |
| - | Prepreg | 0.102 mm |
| 3 | Copper Layer 3 | 35 μm |
| - | Rogers RT duroid 6010.2LM Core | 1.27 mm (50 mil) |
| 4 | Copper Layer 4 (Outer Bottom) | 35 μm |
Artwork, Quality Standard and Availability
The PCB is supplied with artwork in the Gerber RS-274-X format, the industry-standard format for PCB fabrication.
It adheres to the IPC-Class-2 quality standard, a globally recognized benchmark that guarantees consistent performance, reliable manufacturing quality, and compliance with industry requirements.
Additionally, this PCB is available worldwide, catering to the needs of international clients and microwave circuit projects across the globe.
![]()
Introduction to RT duroid 6010.2LM Material
RT/duroid 6010LM microwave laminates are ceramic-PTFE composite materials specifically designed for electronic and microwave circuit applications that require a high dielectric constant. RT/duroid 6010.2LM laminates offer a high dielectric constant (Dk) to enable significant circuit size reduction, while maintaining low loss characteristics—making them ideal for operations at X-band or below. Furthermore, their tight Dk and thickness control ensure repeatable circuit performance, critical for high-reliability microwave applications.
Key Features of RT duroid 6010.2LM Material
| Key Features | Specifications |
| Dielectric Constant (Dk) | 10.2 +/- 0.25 |
| Dissipation Factor | 0.0023 at 10 GHz |
| Coefficient of Thermal Expansion (CTE) | X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C (matched to copper) |
| Decomposition Temperature (Td) | 500 °C (measured via TGA) |
| Thermal Conductivity | 0.86 W/mk |
| Flammability | UL 94 V0 standard |
| Copper Foil | Clad with standard and reverse treated electrodeposited copper foil |
Benefits of RT duroid 6010.2LM Material
-High dielectric constant enables significant circuit size reduction, optimizing space utilization in compact electronic systems.
-Low loss characteristics make it ideal for operating at X-band or below, ensuring minimal signal attenuation and high signal integrity.
-Tight Dk and thickness control guarantees repeatable circuit performance, critical for high-reliability microwave applications.
-Low moisture absorption enhances long-term reliability and stability in varying environmental conditions.
-Enables reliable plated through-holes in multi-layer boards, ensuring robust interlayer connectivity and mechanical durability.
Typical Applications
Leveraging its high Dk, low loss, and repeatable performance, this PCB is specifically engineered for the following microwave and high-reliability applications:
-Patch Antennas
-Satellite Communications Systems
-Power Amplifiers
-Aircraft Collision Avoidance Systems
-Ground Radar Warning Systems
Conclusion
This 4-layer rigid PCB, fabricated using Rogers RT duroid 6010.2LM ceramic-PTFE composite microwave laminate, integrates superior dielectric performance, low-loss characteristics, and robust structural reliability, which are critical for high-reliability microwave applications.
The intrinsic advantages of RT duroid 6010.2LM—including a high dielectric constant (Dk) for circuit miniaturization, low loss for X-band and below operations, tight dimensional and Dk control, and reliable plated through-holes—position this PCB as a high-performance solution for microwave and aerospace-related applications.
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